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Core technology

The chip integration of photonic systems and further chip optoelectronics integration on silicon-based wafers not only reduces chip size, reduces costs, power consumption, and improves reliability. The integrated fabrication of photonic devices is realized by using CMOS microelectronic process based on silicon materials. It is considered by the industry to be one of the technologies that continues the development of Moore's Law.

Silicon Photonic Integrated Chip Technology

Tunable photonic technology refers to technology that continuously changes the wavelength of lasers within a certain range. Precision measurement technologies such as Frequency Modulated Continuous Wave (FMCW), Optical Frequency Domain Reflection (OFDR), and Frequency Sweep Interferometry (FSI) require that the laser must be able to continuously sweep the frequency without mode hopping over a wide range, and have high sweep linearity and narrow linewidth.

Tunable Photonic Technology

High-precision laser measurement technology refers to the technology that achieves high-precision and high-resolution measurement through high-linearity swept laser. For example, based on FMCW LiDAR, micron-level spatial ranging accuracy can be realized; The optical sensing technology based on OFDR can be used for the detection of ultra-high sensitivity and spatial resolution of strain, temperature, dispersion and other parameters.

High-precision Laser Measurement Technology

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